1. 2. 3. material content data sheet sales product name tda5210 issued 7. september 2015 ma# ma000223760 package pg-tssop-28-1 weight* 107.00 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.457 2.30 2.30 22966 22966 leadframe non noble metal nickel 7440-02-0 14.398 13.46 134561 non noble metal iron 7439-89-6 19.882 18.58 32.04 185822 320383 wire noble metal gold 7440-57-5 0.938 0.88 0.88 8768 8768 encapsulation organic material carbon black 1333-86-4 0.196 0.18 1833 plastics epoxy resin - 8.301 7.76 77585 inorganic material silicondioxide 60676-86-0 56.867 53.15 61.09 531486 610904 leadfinish non noble metal tin 7440-31-5 1.559 1.46 1.46 14568 14568 plating noble metal silver 7440-22-4 1.416 1.32 1.32 13231 13231 glue plastics acrylic resin - 0.196 0.18 1836 noble metal silver 7440-22-4 0.786 0.73 0.91 7344 9180 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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